Reduce inspection costs by implementing a pre-shipment
final vision inspection system
System Features
- High resolution: Solder mask inspection using high resolution color CCD camera
- Fast scanning: 13-18.5 sec/strip (dual scanning) high speed inspection
- High accuracy: Inspection using algorithms designed for minute defects
- Multiple functions: Multiple cameras inspect each portion of the product
Detailed Equipment Specifications
System Handling
- Top & Bottom double-side auto reverse inspection
- Strip format: 120-270(L) x 25-70(W) mm
- Stack length: 500 strips/200mm
- Pick & Place transfer/index table
- Auto-sorting of good and defective products
- Stage with Clean Roller to remove foreign material (Option)
System Functions
- Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W CCD)
- Resolution settings: 2.4-8um/pixel (manual)
- Strip format: 25-270(L) x 25-70(W) mm
- Dual CPU & Multi DSP image processing system
- Auto-focus and software auto-calibration unit
- PC base control host
- Continuous inspection made possible with parallel processing
- High intensity white light source
- Create inspection area with CAD Link (Option)
- Re-check defect data with verification station
Inspection Functions
- Contamination, discoloration, nodule, dent, scratch, exposed Ni, unplating, pinhole, foreign material, disconnection, short circuit, chipping, bump
- SR peeling, irregularities, contamination, unplating, foreign material on SR, foreign material in SR, unfilled through hole, delamination, SR convexity
Inspection Items
- Bonding pad, power ring, ball pad, FC pad, solder mask
Dimensions
- SIZE: 1,800 (L) x 1,060 (W) x 1,800 (H) mm