Reduce inspection costs by implementing a pre-shipment final vision inspection system
System Features
- High resolution: Solder mask inspection using high
resolution color line CCD camera - Fast scanning: 70m/hour
high speed inspection - High accuracy: Inspection using
algorithms designed for minute defects - Multiple functions:
Multiple cameras inspect each portion of the product
Detailed Equipment Specifications
System Handling
- High speed handling with tension control unit
- Anti-static electricity unit reduces buildup of foreign material
- Punching unit with X-Y table
- Shaft diameter: 25.4mm
- Reel diameter: Max. 650mm
- Tape width: 35mm, 48mm, 105mm (systems compatible with tape widths greater than 105mm under development)
- Board thickness: Min.25um
Processing System
- Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W CCD)
- Resolution settings: 2.4-8um/pixel (manual)
- Dual CPU & Multi DSP image processing system
- PC base control host
- Continuous inspection made possible with parallel processing
- Create inspection area with CAD Link (Option)
- Re-check defect data with verification station
Dimensions
- SIZE: 825 (L) x 1,200 (W) x 890 (H) mm
Exterior Photograph of Defect Detection Mode
Stain/Discoloration
Dent
Scratch Copper
Metal Pit
Metal Pit
Micro Pit
Cover Coat Defect
Lead Reduction
Delamination
Pl Hole
