UTECHZONE CO.,LTD.
Reduce inspection costs by implementing a pre-shipment final vision
inspection system
Inspection for PBGA/SIP/CSP
- High resolution: Solder mask inspection using high resolution color CCD camera
- Fast scanning: 13-18.5 sec/strip (dual scanning) high speed inspection
- High accuracy: Inspection using algorithms designed for minute defects
- Multiple functions: Multiple cameras inspect each portion of the product
Inspection for Flip Chip / Cavity Down
- High resolution: Solder mask inspection using high resolution color CCD camera
- Fast scanning: 2.0 sec/unit (dual surface inspection) high speed inspection
- High accuracy: Inspection using algorithms designed for minute defects
- Multiple functions: Multiple cameras inspect each portion of the product
Reel type final vision inspection system COF,TAB…
- High resolution: Solder mask inspection using high resolution color line CCD camera
- Fast scanning: 70m/hour high speed inspection
- High accuracy: Inspection using algorithms designed for minute defects
- Multiple functions: Multiple cameras inspect each portion of the product
Perform pinpoint inspection for after-inspection review
to prevent defects from getting sent to the next process
- High resolution: High precision positioning with precise stage movements
- Operability: Semi-automatic movement reduces inspector material handling loss
- Data transfer: Connect to equipment through LAN for smooth data access
- Multiple functions: User may select between microscope inspection and monitor inspection